Thermal Analysis and Design Services

Explore top LinkedIn content from expert professionals.

Summary

Thermal analysis and design services help engineers and manufacturers manage heat within systems, ensuring products operate safely and reliably. These services cover everything from calculating heat transfer and stress in equipment to selecting materials and cooling solutions that prevent overheating and improve performance.

  • Prioritize safety checks: Always assess equipment under real-world conditions—including thermal cycling, pressure, and mechanical loads—to spot potential risks early in the design process.
  • Choose smart materials: Select materials that match your application's temperature, corrosion resistance, and fabrication needs to avoid failures and extend the product's lifespan.
  • Plan cooling strategies: Incorporate cooling features such as heat sinks, vapor chambers, or optimized PCB layouts to spread heat efficiently and keep critical components within safe temperature limits.
Summarized by AI based on LinkedIn member posts
  • View profile for Jefy Jean Anuja Gladis

    Sales Manager @ Schrader | Process Engineering | Ex-Linkedin Top Voice | Master of Engineering - Chemical @ Cornell | Six Sigma Black Belt | JN Tata Scholar | Content Creator | Global Career & Technical Storytelling

    30,483 followers

    𝗗𝗲𝘀𝗶𝗴𝗻𝗶𝗻𝗴 𝗮 𝘃𝗲𝘀𝘀𝗲𝗹 𝗺𝗲𝗮𝗻𝘀 𝗮𝘀𝗸𝗶𝗻𝗴: Will it survive thermal cycling? Can it handle nozzle loads and wind stress? What happens during a vacuum collapse? If you only think in terms of diameter and thickness, you're missing the bigger picture. Let’s break it down 👇 As per ASME Section VIII, Div 1 & 2 ✅ Internal pressure: Hoop & longitudinal stresses via thin-wall or thick-wall formulas ✅External pressure: Requires stiffening rings, especially in tall columns or vacuum-rated vessels ✅Stress combinations: Consider dead load, wind/seismic (per ASCE 7), thermal gradients, and nozzle-induced stresses ✅Corrosion allowance: Typically 1.5–3 mm for carbon steel, adjusted based on process medium ✅Joint efficiency & weld inspection: Dictates allowable stress values based on radiography or UT compliance 📌 Design Inputs ✅Design pressure & temperature: Basis for material selection and wall thickness ✅Operating envelope: Define min/max conditions to address cold/hot cycling ✅L:D ratio: Short/fat vessels reduce wind loading but may raise material costs 📌Head type: ✅Hemispherical: High strength, high cost ✅2:1 Elliptical: Balance of stress distribution and fabrication ease ✅Torispherical: Economical for low-pressure designs ✅Internals like demister pads, trays, or baffles must be structurally supported and stress-checked. 📌Thermal Considerations: Expansion, Stresses, and Heat Transfer ✅Thermal gradients cause differential expansion → fatigue ✅Jacketed vessels need design for inner/outer shell pressure and flow distribution ✅Allow for expansion joints, support flexibility, and drainability ✅Evaluate material embrittlement temperatures (especially for low-temp services) ✅ PWHT: Post-weld heat treatment is mandatory for certain thickness/material combinations to relieve residual stress and meet notch toughness. 📌Support Design Impacts Stresses and Foundation Loads ✅Vertical vessels → skirt supports, possibly with gussets ✅Horizontal vessels → saddle supports with allowable spacing based on vessel weight and bending moments ✅Ensure baseplate design includes anchor bolt pull-out, moment resistance, and slotted holes for expansion ✅Wind and seismic design as per API 650, ASCE 7, or IS 875 ✅Lifting lugs, trunnions, and transportation saddles must be FEA-validated for static & dynamic loading 📌Material Selection: ✅Allowable stress at temp (ASME Sec II, Part D) ✅Corrosion resistance vs fluid compatibility ✅Fabricability (weldability, formability) ✅Impact toughness at low temps (per ASME UG-84, UCS-66) ✅For sour service (H₂S), NACE MR0103 compliance is critical. Use Austenitic SS, duplex steel, or Inconel depending on chemical exposure and design temp.

  • View profile for Hosni Sadki

    Process Engineer

    60,266 followers

    🚀 Just Built: A Complete Shell & Tube Heat Exchanger Design Excel Tool After one too many late nights flipping between textbooks, charts, and scattered spreadsheets, I decided to build something better. What this workbook covers: ✅ Full Kern Method — Step-by-step from duty definition to final validation ✅ Automated calculations — Heat load, LMTD, correction factors, tube counts, shell diameter ✅ Built-in reference data — Fouling resistances, assumed U-values (Fig 19.1), tubesheet ligaments ✅ All the "Abaques" you need — JH=f(Re) and JF=f(Re) for tube & shell side, F-factor charts, bundle clearance curves ✅ Pressure drop validation — Both tube and shell side with iterative convergence Key features for busy process engineers: Fluid allocation logic (corrosive fluids → tube side) Split-ring floating head sizing with standard clearances Automatic check: |U_calc - U_assumed|/U_calc < 30% ✓ Triangular/square pitch support with standard constants (K1, n1) The reality: Most HEx design tools are either oversimplified or locked behind expensive software licenses. This hits the sweet spot—rigorous enough for real projects, accessible enough for quick studies or student learning. Built for: Conceptual sizing, bid packages, teaching heat transfer, or validating vendor quotes. Process engineers: What's your biggest pain point in thermal design? Still using hand calculations, or have you moved to full simulation suites? #ProcessEngineering #HeatExchanger #ChemicalEngineering #ThermalDesign #Excel #KernMethod #HVAC #OilAndGas #ProcessDesign #EngineeringTools

    • +11
  • View profile for VISHNUPRIYA _D

    Printed Circuit Board Designer

    2,724 followers

    Sharing my new Thermal PCB Design Guideline, created to help engineers design reliable, high-performance boards for modern power electronics. This guideline highlights the critical elements of thermal design—identifying high-heat components, selecting suitable PCB materials, applying smart component placement, optimizing high-current traces and copper areas, using thermal vias effectively, and meeting IPC/UL thermal standards. It also includes practical methods for improving heat spreading and cooling in SMPS, motor drivers, EV chargers, LED systems, and embedded hardware. A valuable reference for anyone focused on building cooler, safer, and more efficient PCBs. #PCBDesign #ThermalManagement #PowerElectronics #HardwareDesign #EmbeddedSystems #HighPowerDesign #EngineeringDocumentation

  • View profile for Nirmal Sharma , PhD

    Advanced Packaging Consultant @ Advanced Packaging | Customer Quality, Operations Management

    5,001 followers

    Breaking the thermal wall with material innovation Performance is now limited by heat as much as logic. Beating the thermal wall demands a materials‑first approach paired with tight electro‑thermo‑mechanical co‑design. What moves the needle - Next‑gen TIMs: liquid‑metal gallium alloys for ultra‑low interface resistance; sintered silver for near‑bulk conductivity and high‑temp stability; phase‑change and graphene/graphite‑enhanced TIMs for thin, reliable bond lines. - Heat spreading ultrathin vapor chambers, pyrolytic graphite sheets, and composite lids (e.g., Cu‑diamond) to flatten hot spots before the sink. - Microchannel cooling: single‑phase cold plates for hundreds of W/cm² with modest ΔP; two‑phase and jet impingement for the highest flux; additive‑manufactured manifolds and fins to unlock flow and surface area. - Package co‑design: direct‑to‑die cooling, embedded spreaders, and low‑CTE, high‑k substrates to manage both heat and warpage. From concept to production - Engineer the interface: flatness, roughness, bondline control, and clamp load dominate real‑world Rθ. - Prove reliability: resist pump‑out, dry‑out, creep, and galvanic effects; ensure coolant/material compatibility. - Model and measure: disciplined compact models and standardized test methods keep simulations honest. How we can help We combine materials science with system co‑design to turn thermal limits into headroom. We have all the Credence design tools and can help with thermal management using the best TIMs and microchannel solutions for your challenging application. Share your power map, allowable pressure drop, and constraints—we’ll deliver a material stack and cooling architecture with modeled junction temps, flow/pressure requirements, and a clear reliability plan.

  • View profile for Shukrah Olabiyi

    Doctoral Student || Geologic Carbon Storage Researcher || CCUS Enthusiast || Process engineer

    6,768 followers

    🔧 Two Years of Process Engineering at Dangote Refinery: A Milestone Marked by Technical Excellence 🔧 To commemorate two productive years as a process engineer at Dangote Refinery, my team and I delivered a technical presentation to the Vice President and other directors on Shell and Tube Heat Exchangers (STHEs)—a crucial equipment in oil refinery and chemical process. The presentation covered the following key areas: ✅ Classifications of STHEs: Based on number of passes (single, double, and multiple), Flow configurations (co-current, counter-current, and crossflow), and Construction types (fixed tube sheet, floating head, and U-tube designs). ✅ Components Analysis: Detailed discussions on the functionality of critical components such as the shell, tubes, baffles, tube sheets, and nozzles. Each component was analyzed for its role in enhancing heat transfer efficiency and mechanical reliability. ✅ Working Principles: Explored the mechanisms of heat exchange between two fluid streams, emphasizing key design considerations for maximizing performance while minimizing fouling and pressure drops. ✅ Thermal Design and Optimization: Focused extensively on the technical aspects, including: Thermal efficiency optimization and heat transfer coefficient calculations, Log Mean Temperature Difference (LMTD) analysis, Handling design challenges such as flow-induced vibration and thermal expansion. ✅ Case Study from Refinery Operations: Analyzed the series and parallel configurations of shell and tube exchangers in a specific process unit. We discussed the operational rationale for each arrangement, highlighting their impact on pressure drop, thermal performance, and process flexibility. This presentation reflected the essence of our roles as process engineers: combining theoretical knowledge with practical application to optimize refinery operations. As I look ahead, I remain committed to leveraging technical expertise and innovative ideas to drive and enhance operational excellence and sustainability in the energy industry. #ProcessEngineering #ShellAndTubeExchangers #HeatTransferOptimization #DangoteRefinery #EngineeringExcellence

  • View profile for Fernando Romo Sanchez

    Process System Technolgy Manager Lead in Samsung engineering and construction, oil and gas Inc.Specialst in valves overpressure PSV and Centrífugal Pumps

    7,984 followers

    Calculations for pipe terminals in Liquefied Natural Gas (LNG) facilities are critical for ensuring safety, maintaining structural integrity under extreme cryogenic conditions (-162°C), and enabling efficient, accurate custody transfer. Key calculations focus on stress analysis, thermal contraction, flow rates, and insulation performance. Important Pipe Calculations in LNG Terminals Thermal Stress and Expansion Analysis: LNG piping experiences extreme temperature changes (ambient to -162°C). Calculations ensure the pipe can withstand contraction without failing or damaging supports. Pressure-Temperature Rating (Flange Sizing): Choosing appropriate flange ratings (e.g., CL150 or CL300) to ensure the seal can handle both low temperatures and operating pressures to avoid leaks. Flow Rate and Pipe Sizing (Hydraulic): Determining optimal pipe diameter (e.g., 10-inch) to handle high-velocity LNG unloading (e.g., 300,000 to 520,000 m³/day). Boil-Off Gas (BOG) Generation: Estimating the amount of vapor produced in the pipeline to size recondensers and vent systems. Pre-cooling/Cool-down Time: Calculating the time required to cool down piping from ambient to operational temperatures (e.g., -120°C) to prevent thermal shock. Example: LNG Unloading Pipeline Stress Analysis Context: A 10-inch diameter stainless steel pipeline (e.g., SUS304) is used to transfer LNG from a tanker to a storage tank. The Problem: The temperature changes from +20°C (ambient) to -162°C (liquid). Calculation Needed: The pipe will contract significantly. The engineering team must calculate the contraction distance and the resulting stress on piping anchors, elbows, and flanges. Importance: If not calculated, this expansion/contraction can tear pipes from supports or cause flange leaks. Solution/Design: Installing expansion loops or expansion joints based on the calculated thermal growth. Example: Pipeline Pre-cooling Simulation Scenario: A 737m, 1000mm diameter unloading pipeline at the Zhejiang LNG terminal needs to be prepared for LNG entry. Calculation: Using MATLAB to simulate BOG flow through the pipeline to determine the time to reach -120°C. Result: The simulation showed that, when controlling the wall temperature drop rate at 10°C/h, the process takes approximately 30.25 hours. Key Components of Pipe Calculations Material Selection: Austenitic Stainless Steel (e.g., A182-F304/304L) for high strength at low temperatures. Insulation: Vacuum insulated pipes (VIP) or polyurethane foam to prevent excessive heat gain. Support Design: Designing pipe supports to handle 30% additional load due to acceleration from marine conditions (for unloading arms).

  • View profile for Jett C.
    23,925 followers

    ♨️ SemiVision: This insightful paper from the Georgia Institute of Technology explores thermal management strategies for heterogeneous integration of high-bandwidth memory (HBM) and GPUs, especially addressing the challenge of component height mismatches within advanced modules. The researchers propose and evaluate multiple system-level thermal solutions, including top-side cooling, structural integration, and materials engineering. Using Computational Fluid Dynamics (CFD) and thermal conduction analysis, they demonstrate that combining liquid cooling, integrated copper structures, and high-conductivity epoxy molding compounds can significantly reduce system temperatures. The study also examines how the spacing between HBM and GPU impacts thermal coupling, underscoring the importance of efficient thermal design in advanced multi-chip configurations for next-gen computing systems. #IEEE #ECTC2025 #ThermalManagement #HBM #GPU #HeterogeneousIntegration #AdvancedPackaging #GeorgiaTech

  • View profile for Robert Kropiniewicz, MBA, PMP

    Director of Engineering & Operations | Manufacturing Growth | Product Launch | Continuous Improvement | Executive Leadership

    2,668 followers

    Thermal Expansion — The Hidden Risk in High-Precision Design One of the most frequently overlooked factors during the design phase is thermal expansion, especially in assemblies with tight dimensional tolerances. It’s easy to get caught up in the nominal dimensions, CAD models, and tolerance stack-up, but materials don’t stay the same under operational temperatures. When tolerances are in the range of microns or fractions of a millimeter, even modest temperature changes can introduce dimensional instability, interference fits, or loss of critical clearances. I’ve encountered cases where components that were perfectly within spec at 20°C experienced binding, buckling, or misalignment at elevated temperatures due to thermal growth. In high-performance systems; whether it's in precision automation equipment, rotating machinery, or thermal enclosures. Overlooking the coefficient of thermal expansion (CTE) can lead to costly rework or failure in the field. A few engineering best practices to mitigate thermal issues: Apply thermal FEA simulations early in the design process to predict expansion patterns which SHOULD always be backed up with a mathematical model. Use multi-body thermal analysis in conjunction with modal or static structural simulations to assess stress concentrations caused by differential expansion. Select materials with matched or compatible CTEs for mated components. Design in thermal relief features, such as compliant joints or expansion gaps. Consider worst-case temperature scenarios, not just nominal operating conditions. Thermal effects aren’t always dramatic, but when tolerances are tight, they don’t need to be. Even a 0.001" shift can cause assembly failures, seal leaks, or performance degradation. Design for reality, not just the drawing.

  • View profile for Jesse D. Beeson

    Author | Engineer | FPGA Product Development & Commercialization | CEO @ Xlera Solutions

    4,637 followers

    Here's the reality that kills FPGA projects. Your brilliant digital design delivers amazing performance in simulation, but when thermal throttling kicks in at 85°C, your real-world performance drops 40%—and your mechanical team is scrambling to retrofit cooling solutions. 𝗧𝗵𝗲 𝗧𝗵𝗲𝗿𝗺𝗮𝗹 𝗥𝗲𝗮𝗹𝗶𝘁𝘆 𝗖𝗵𝗲𝗰𝗸 Modern FPGAs pack incredible processing power into compact packages, generating heat densities that challenge traditional cooling approaches. Your FPGA team optimizes for performance while your mechanical team designs for aesthetics and cost. When these worlds collide in production, thermal limits force performance compromises that undermine your entire value proposition. 𝗛𝗼𝘄 𝗜𝗻𝘁𝗲𝗴𝗿𝗮𝘁𝗲𝗱 𝗙𝗣𝗚𝗔 𝗠𝗲𝗰𝗵𝗮𝗻𝗶𝗰𝗮𝗹 𝗗𝗲𝘀𝗶𝗴𝗻 𝗣𝗿𝗲𝘃𝗲𝗻𝘁𝘀 𝗣𝗲𝗿𝗳𝗼𝗿𝗺𝗮𝗻𝗰𝗲 𝗟𝗼𝘀𝘀 True FPGA mechanical integration starts with thermal modeling during HDL development. Chassis design considers airflow patterns, heat sink mounting, and thermal interface materials from day one. Component placement optimization reduces hot spots. Mechanical constraints inform FPGA resource utilization decisions, while performance requirements drive thermal management strategies. Integrated Mechanical Results We're Delivering: → FPGA systems maintaining full performance across 0-70°C operating range → 50% reduction in cooling requirements through optimized thermal design → Compact form factors achieving server-class FPGA performance → Fanless designs for noise-sensitive applications maintaining full throughput → EMI/EMC compliance achieved through mechanical-electrical coordination → Manufacturing costs reduced 30% through integrated design optimization The Performance Multiplier: When mechanical and FPGA teams collaborate from concept phase, your system delivers sustained peak performance instead of thermal-limited compromise. No more derating specifications because of thermal constraints discovered too late. For Technical Leaders: This isn't just about preventing overheating—it's about delivering the performance your customers paid for, consistently, across all operating conditions. The bottom line: FPGA mechanical integration ensures your hardware delivers promised performance in real-world conditions, not just controlled lab environments where thermal limits aren’t reached. Ready to design FPGA systems that maintain peak performance everywhere? What thermal challenges are limiting your FPGA system performance? Let's discuss integrated mechanical solutions. #fpgadesign #fpga #hardwaredesign #productdevelopment #innovation

  • View profile for Suleiman Yusuf

    10+ Years | Lead Process & Operations Engineer | Driving Reliability | Energy Optimization | Proven Impact at Dangote Refinery | Expert in Commissioning, Troubleshooting, & Operational Excellence | Team Collaboration

    2,112 followers

    Detailed Design of Heat Exchangers in Process Industries In process industries such as refineries, petrochemical plants, and energy facilities, heat exchangers are essential components. Effective design encompasses not only thermal calculations but also integrates mechanical integrity, safety, material selection, and operational ease, all while complying with international standards. Key Design Considerations & Applicable Standards: Thermal Design - Heat duty, LMTD, effectiveness, and allowable pressure drop - Accounting for fouling factors and potential future performance issues - Standards/Guides: TEMA, ISO 13706, HTRI / Aspen (industry practice) Mechanical Design - Designing the shell, tube, channel, and nozzles - Considering design pressure & temperature, along with corrosion allowances - Standards: ASME Section VIII (Div 1/2), TEMA Class R/B/C Materials Selection & Corrosion Control - Evaluating fluid corrosivity, sour service, and chloride stress cracking - Choosing the right metallurgy and determining corrosion allowances - Standards: NACE MR0175 / ISO 15156, NACE MR0103 Fabrication & Construction - Planning tube layout, tube-to-tubesheet joints, and expansion joints - Ensuring proper welding, PWHT, and inspection protocols - Standards: ASME Section IX, TEMA, ISO Fire & Process Safety - Designing for fire scenarios, leak containment, and layout spacing - Implementing protections against escalation in hydrocarbon services - Standards: API 521, NFPA 30 / 45 / 850 (as applicable) Inspection, Testing & Maintainability - Conducting hydrostatic testing, NDT, and mechanical integrity assessments - Ensuring accessibility for cleaning and future maintenance - Standards: ASME, TEMA, API recommended practices Why Standards Matter Utilizing standards from API, ASME, TEMA, NFPA, NACE, and ISO ensures: - Safe operation during both normal and upset conditions - Long-lasting reliability and resistance #HeatExchangerDesign #ProcessEngineering #ASME #API #TEMA #NACE #NFPA #ISO #OilAndGas #EnergyEngineering

Explore categories