You’ve designed a Micro Lens Array (MLA) or Surface Relief Waveguide…now what?

What’s the best approach to making a prototype and subsequently scale to production?

LIDAR, Optical Datacom, Eye/Hand Tracking, Micro-LED Display and Light Field Display manufactures are discovering that MLAs are an excellent choice for managing light distribution.

Manufactures of Augmented Reality (AR) smart glasses are converging on the use of surface relief waveguides to create the virtual image that’s overlaid on the real world.

Prototyping can be achieved by the following processes:

1.       Direct 2 Photon Polymerization (Nanoscribe)

2.       Soft tool molding

3.       Single Point Diamond Turning (Moore’s Nanotech)

4.       Direct Laser Writing (Heidelberg)

5.       E-beam writing

Scaling to higher volumes there are several options:

1.       Wafer level nanoimprint lithography (NIL) using soft masters (EV Group)

2.       Roll to Plate nanoimprint using soft masters (Morphotonics)

3.       Micro-Injection Molding

Nanoimprint Lithography

Nanoimprint lithography (NIL) is a patterning technique that uses a nanostructured stamp to mechanically press features into a layer, which is then cured (typically with UV light or heat) to form the pattern. It enables cost-effective, large-area fabrication of sub-wavelength structures such as gratings, refractive and diffractive elements with very high fidelity.

AR waveguides:  NIL can replicate high-index, low-haze, slanted or blazed gratings for in-/out-coupling and pupil expansion on glass at wafer scale, exactly what AR demands for field-of-view, brightness, and uniformity. Recent work shows NIL maintaining fidelity across large areas, including slanted gratings used in modern combiners.

Light-field displays:  Micro-lens arrays (MLAs) define view count, parallax quality, and MTF. Replicated MLAs (via molding or UV-NIL) deliver the pitch accuracy and uniformity needed for light-field capture or display, with emerging GRIN approaches pushing even higher integration. In some cases, these displays require a double-sided MLAs that are precisely aligned to each other. 

Co-packaged optics (CPO). Efficient, thermally resilient MLAs are becoming the default interface between PICs and fibers/optical connectors. Standards activity around CPO underscores packaging density, thermals, and reliability—exactly where replicated micro-optics shine. Material systems are available that even withstand the solder-reflow process step so the optic can be integrated before final packaging.

Wafer level and panel level NIL enables high throughput production with UV-curable, high-index resins and excellent pattern fidelity over large areas.

Where it shines

• AR combiners: slanted/blazed gratings for in-coupling, pupil expansion, out-coupling on high-index glass.
• Diffractive Optical Elements that would be prohibitively expensive via e-beam or grayscale lithography in production.

Micro-Injection Molding (MIM)

Micro-injection molding is a high-precision manufacturing process that injects molten polymer into ultra-fine molds to produce tiny parts with micro-scale features and tight tolerances.  It is best suited for 3D refractive micro-optics (lenslets, prisms, light pipes) in COC/COP/PMMA/PC with surface roughness in the low-nm and sub-μm form accuracy on the right press, tool, and process window. It’s mature and a high-throughput process.

Where it shines

• Rugged, lightweight optics for AR projector modules and sensor windows.
• Heat and moisture resistant optics for LIDAR and Heads Up Display light engines.
• MLAs for Co-Packaged Optics (CPO) coupling where thermo-mechanical stability matters (advanced thermoplastics, low birefringence).

Market signals you shouldn’t ignore

• The OIF Co-Packaging Framework keeps pulling optics closer to the switch/ASIC—optical coupling is now a packaging problem as much as an optics problem.
• AR manufacturing papers and SPIE talks continue to emphasize large-area NIL and replication of slanted gratings—exactly the path to volume.

Take Aways:

1. Choose the replication path by function: Micro-Injection Molding vs. Nanoimprint Lithography?  In some cases, we can develop a hybrid process if it’s a mixed stack.
2. Design for manufacturability: add draft angles, manage slopes, and spec roughness & pitch tolerances aligned to process capability.
3. Qualify materials early: we can help you choose the right material system based on operating wavelengths and operating conditions.  We can validate index/haze/UV stability, thermal cycling and reflow.
4. Determine if wafer or panel level NIL is the best option: cross wafer/panel alignment specifications, stamp lifetime, and tool uptime drive your true cost curve.