Brian Scot Stelter

Searching for New FHE Pathways: Aligning for Relevance in a Post-COVID World There is a growing sense of urgency—and opportunity—within the flexible hybrid electronics (FHE) community. As we navigate a rapidly evolving post-COVID global landscape, industry groups and stakeholders are currently engaging in deeper dialogue to realign strategies and better serve their ecosystems. We must be honest in acknowledging that FHE has not yet exceeded its early growth expectations. To achieve broader prominence and commercial viability, the field must align more deliberately with the four major innovation categories that will define the next decade. To build a strong ecosystem, we must;  1) Increase Collective Exposure 2) Facilitate End-to-End Partnerships 3) Expand Grant-Based Support Further details of this outline is in the attached document. Let us know what you think in the comments section. We would love to hear from you. OE-A (Organic and Printed Electronics Association), NextFlex, FlexTech, a SEMI Strategic Association Partner IEEE Journal on Flexible Electronics (J-FLEX), IEE Sensing, IEEE International Flexible Electronics Technology Conference (IFETC), IPC, Bendable Electronics and Sustainable Technologies (BEST) Group, TechBlick, IDTechEx, IEC (International Electrotechnical Commission), International Microelectronics Assembly and Packaging Society (IMAPS), IEEE ECTC, Society For Information Display, Advanced Functional Fabrics of America (AFFOA) #printedelectronics #bayflexsolutions

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For 2026, we see semiconductor packaging entering its most transformative phase yet, driven by unprecedented demands from AI, high-density power electronics, heterogeneous integration, and the shift toward ultra-high-performance system architectures. As a technical marketing and content development partner for companies across the advanced packaging ecosystem, 360 is expanding its capabilities to support this momentum. https://lnkd.in/gwHA6-fE

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6G is no longer theoretical and the #engineering decisions being made today will define what comes next. Jessy Cavazos, Keysight’s #6G Solutions Lead, speaks with Kalyan Sundhar, Vice President and General Manager of Wireless Technologies at Keysight, on the practical realities behind #FR3 spectrum, non-terrestrial networks, sensing monetization, and AI-driven connectivity. Read the blog to understand how these technologies are shaping scalable, real-world 6G networks: https://gag.gl/Q6jKVU

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Intel 18A is the most advanced semiconductor node developed and manufactured in the United States. Arizona’s Fab 52 is fully operational and set to reach high-volume production using Intel 18A later this year, strengthening U.S. technology and manufacturing leadership. Truly impressive!

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Pleased to see this program launch. Building the ecosystem takes more than great technology - it takes strong partners, better enablement, and a simpler path from evaluation to production.

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Excited to be attending #NvidiaGTC this week. At Allegro Microsystems, we’re collaborating with industry leaders to tackle the toughest AI data center power and cooling challenges using innovative current/power sensing, isolated gate drivers, and motor driver technologies. If you’ll be there, I’d welcome the chance to connect and exchange ideas. #AIInfrastructure #DataCenter #PowerElectronics #ThermalManagement #Semiconductors #PowerManagement #AIDataCenters

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In power electronics R&D, the measurement setup is as important as the design. For capturing switching current waveforms (loss analysis, snubber currents, capacitor ripple), a shielded Rogowski probe like CWTMini50HF helps reduce dV/dt pickup while keeping bandwidth high.

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Photon Bridge has improved the assembly throughout for heterogeneous integration onto PIC's. Test hardware is also improved. eliminating the need for complex hexapods. The industry now has a cost effective and scalable solution.

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Magillem Connectivity by Arteris automates and simplifies the manual SoC integration process by accelerating development while improving quality and traceability. Watch the video to learn more and see how it could benefit your projects!

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Excited to share that iDEAL Semiconductor has signed a technology partnership agreement with Richardson Electronics, Ltd. for our SuperQ product line. Richardson’s deep technical expertise and global footprint in power systems make them an ideal partner to bring SuperQ into customer designs worldwide. This partnership marks another important step as we scale SuperQ and deliver industry-leading silicon performance into real-world applications. Read more: https://lnkd.in/gyx6cZdQ

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