Cliff (Haibin) Zhang, PhD, MBA

Cliff (Haibin) Zhang, PhD, MBA

Lexington, Massachusetts, United States
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About

Extensive experience in the capital equipment business from both business and technology…

Activity

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Experience

  • MKS Instruments Graphic

    MKS Instruments

    Andover, Massachusetts, United States

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    Boston, Massachusetts, United States

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    United States

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    Portland, Oregon Area

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    Portland, Oregon Area

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    Portland, Oregon Area

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    Portland, Oregon Area

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    Fremont, California

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    Toronto, Canada

Education

  • Harvard Business School Graphic

    Harvard Business School

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    Activities and Societies: Business analytics, digital transformation, machine learning, data analytics

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Licenses & Certifications

Volunteer Experience

  • Junior Achievement of Oregon & SW Washington Graphic

    Lecturer

    Junior Achievement of Oregon & SW Washington

    - Present 11 years 7 months

    Economic Empowerment

    Taught lectures of personal finance and financial planning to 8th graders at local Stoller middle school. One of the most rewarding teaching I have ever done.

Publications

  • Laser Direct Ablation for Patterning Printed Wiring Boards Using Ultra- fast Lasers and High Speed Beam Delivery Architectures

    JLMN-Journal of Laser Micro/Nanoengineering

    We have developed a vector scanning based laser system for Laser Direct Ablation using a unique beam steering technology combined with a high repetition rate ultrafast laser. One requirement for this application is to control the width and depth of the signal lines at the micron level. The system takes advantage of a proprietary tertiary beam postioning system that uses Acousto-Optic Deflectors (AODs) in addition to the conventional galvanometers and linear stages, and the scheme allows not…

    We have developed a vector scanning based laser system for Laser Direct Ablation using a unique beam steering technology combined with a high repetition rate ultrafast laser. One requirement for this application is to control the width and depth of the signal lines at the micron level. The system takes advantage of a proprietary tertiary beam postioning system that uses Acousto-Optic Deflectors (AODs) in addition to the conventional galvanometers and linear stages, and the scheme allows not only the accurate and high speed beam delivery but also precise material removal.

    Other authors
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  • Heat accumulation effects in femtosecond laser-written waveguides with variable repetition rate

    Optics Expres

    High-repetition rate femtosecond lasers are shown to drive heat accumulation processes that are attractive for rapid writing of low-loss optical waveguides in transparent glasses. A novel femtosecond fiber laser system (IMRA America, FCPA μJewel) providing variable repetition rate between 0.1 and 5 MHz was used to study the relationship between heat accumulation and resulting waveguide properties in fused silica and various borosilicate glasses. Increasing repetition rate was seen to increase…

    High-repetition rate femtosecond lasers are shown to drive heat accumulation processes that are attractive for rapid writing of low-loss optical waveguides in transparent glasses. A novel femtosecond fiber laser system (IMRA America, FCPA μJewel) providing variable repetition rate between 0.1 and 5 MHz was used to study the relationship between heat accumulation and resulting waveguide properties in fused silica and various borosilicate glasses. Increasing repetition rate was seen to increase the waveguide diameter and decrease the waveguide loss, with waveguides written with 1-MHz repetition rate yielding ~0.2-dB/cm propagation loss in Schott AF45 glass. A finite-difference thermal diffusion model accurately tracks the waveguide diameter as cumulative heating expands the modification zone above 200-kHz repetition rate.

    Other authors
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Patents

  • Use of laser energy transparent stop layer to achieve minimal debris generation in laser scribing a multilayer patterned workpiece

    Issued US 7977213

    A solution to failure mechanisms caused by mechanical sawing of a mechanical semiconductor workpiece entails use of a laser beam to cut and remove the electrically conductive and low-k dielectric material layers from a dicing street before saw dicing to separate semiconductor devices. A laser beam forms a laser scribe region such as a channel in the electrically conductive and low-k dielectric material layers, the bottom of the channel ending on a laser energy transparent stop layer of silicon…

    A solution to failure mechanisms caused by mechanical sawing of a mechanical semiconductor workpiece entails use of a laser beam to cut and remove the electrically conductive and low-k dielectric material layers from a dicing street before saw dicing to separate semiconductor devices. A laser beam forms a laser scribe region such as a channel in the electrically conductive and low-k dielectric material layers, the bottom of the channel ending on a laser energy transparent stop layer of silicon oxide lying below all of the electrically conductive and low-k dielectric material layers. The disclosed process entails selection of laser parameters such as wavelength, pulse width, and fluence that cooperate to leave the silicon oxide layer stop layer completely or nearly undamaged. A mechanical saw cuts the silicon oxide layer and all other material layers below it, as well as the substrate, to separate the semiconductor devices.

    Other inventors
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  • Multipulse system for writing waveguides, gratings, and integrated optical circuits

    Filed US 20120039567

    The present invention provides a direct laser writing fabrication method and system for devices having periodic refractive index modulation structures, for example, Bragg gratings.

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  • TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

    Filed US 12/397,567

    Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly…

    Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent...

    Other inventors
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Courses

  • Business decisions for managers

    ISQA513

  • Business development in Asia

    MGMT510

  • Communications for leaders

    BA522

  • Economy and sustainability I

    FIN512

  • Economy and sustainability II

    FIN511

  • Finance for business strategy

    FIN510

  • Financial management

    FIN513

  • Financial reporting

    ACTG511

  • Formations of strategy

    MGMT511

  • Fundamentals of Business Analytics

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  • Leadership

    BA521

  • Managerial accounting and control

    ACTG512

  • Marketing strategy

    MKTG512

  • Organization management

    MGMT512

  • Pioneering innovation

    MKTG511

  • Supply Chain management in Asia

    ISQA510

  • Sustainable operations management

    ISQA511

  • laser material interaction

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  • nonlinear optics

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  • optical communications

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  • quantum mechanics

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Projects

  • Laser singulation and cutting of strengthened glass

    - Present

    Advanced development on glass machining, especially for strengthened glass, in cutting, drilling, singulation with lasers.

  • Laser micro machining and fabrications

    Champion process and applications development on laser machining or micro fabrication tools for consumer electronic, semiconductor, solar, and lighting applications.

  • Laser direct fabrication of Fiber Bragg Gratings

    Direct laser manufacturing of FBGs with Argon ion laser at 244 nm, and with Ti:Sapphire ultrafast laser at 800nm.

  • Laser direct writing of Bragg grating waveguides

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    First demonstration of effective Bragg grating structures in ultrafast laser written optical waveguides in transparent materials.

    Other creators

Test Scores

  • TOEFL

    Score: 670

  • GRE

    Score: 2310

Languages

  • Chinese

    Native or bilingual proficiency

  • English

    Native or bilingual proficiency

Organizations

  • Optical Society of America

    Member

    - Present

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